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Connector for microSDTM Card (Header Type)
SCHD Series
Low-profile with 1.6mm thickness provides improved flexibility in set design.
For SD Memory Card For microSDTM Card For SIM Card 8pins For W-SIM
Features
A comfortable click feel at insertion. Card-guide structure for smoother card insertion.
Applications
For mobile phones and personal digital assistants
For Memory Stick MicroTM For Memory StickTM
Typical Specifications
Items Applicable media Mounting type Structure Mounting style Media ejection structure Operating temperature range Voltage proof Performance Insulation resistance Initial Contact resistance Initial Insertion and removal cycle
Standard mount Manual insertion/removal 20 to 70
Specifications
microSDTM Card Surface mounting type
Combine Type For Compact FlashTM For PC cards supporting CardBus For Express CardTM For CMOS Camera Module
500V AC 1minute 1,000M 100m min. max.
10,000cycles
Product Line
Media ejection structure
Manual insertion/removal
Mounting system
Standard mount
Stand-off mm
0
Packing system
Taping
Product No.
SCHD1A0101
23
Connector for microSDTM Card (Header Type) SCHD Series
Dimensions
Style
Unit:mm
PC board mounting hole dimensions Viewed from the mounting face side
For SD Memory Card For microSDTM Card
3.65 12.5
7.6 1.9 6.15
7.6 6.15 2.65 8.6 10.1
9.80
13.20
11.95
For SIM Card 8pins
15
6.55
For W-SIM For Memory Stick MicroTM For Memory StickTM Combine Type For Compact FlashTM For PC cards supporting CardBus For Express CardTM For CMOS Camera Module
4-1.4
0.1
1.6 Pitch 7-1.1 8-0.3 3.2
8-0.8 Pitch 7-1.1 3.2 13.1 Land area No pattern area No parts area
11.1 14.6
24
2
10.95
2
Small Memory Card Connectors
Soldering Conditions
Example of Reflow Soldering Condition Reference
1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2 CA K or CC T . 3. Temperature profile Surface of products
For SD Memory Card For microSDTM Card For SIM Card 8pins For W-SIM For Memory Stick MicroTM For Memory StickTM Combine Type
240 (max.) Temperature (C ) 230 (min.) 200 180 150 100 Time (s) Pre-heating 90 30 sec. 10 sec.(max.)
Room temperature
Heating time
For Compact FlashTM For PC cards supporting CardBus For Express CardTM For CMOS Camera Module
sec.
Cautions for using this product
1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice.
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